SANYO Semiconductor HOME > Product Information > Hybrid IC (STK Series) > Assembled Structure
Hybird IC (STK Series)
- Inverter HICs for Home Appliances
- Audio Power HICs
- Fusion of Core Technologies
- What Is An “Insulated Metal Substrate”?
- Substrate Structure
- Assembled Structure
- Bare Chip Mounting And Aluminum Wire Bonding
- Assembly Flow
- Heat Dissipation Capability
- High Reliability
- High Performance
Assembled Structure
The IMSTTM substrate, which provides these superlative characteristics, allows a wide range of components to be mounted. These include bare semiconductor chips, all types of SMD components, and connectors and other structural components. This capability makes this mounting technology optimally suited for modularizing entire electronic circuit blocks, each with their own functions. Furthermore, since lead-free solder is used both inside the hybrid ICs and for the frame plating, these components are environmentally sound.
IMSTTM Hybrid IC Assembled Structure
IMSTTM Hybrid IC Structural Elements
| Structual Elements | Material | Process | |
|---|---|---|---|
| Base plate | IMSTTM Substrate | Punching | |
| Circuit Wiring | Copper Foil | Etching | |
| Resistors | Printing | Resin Based Carbon | Screen Printing |
| Chip | SMD | Lead-Free Soldering | |
| Capacitors | SMD | Lead-Free Soldering | |
| Inductor | SMD | Lead-Free Soldering | |
| Structual Components | SMD | Lead-Free Soldering | |
| Semiconductor Devices |
Small-Signal System | Bare Chip | Conducting Paste Junction |
| Power System | |||
| Bare Chip | Solder or Conducting Paste Junction |
||
| Bare Chip Wiring | Aluminum Wire | Ultrasonic Bonding | |
| Jumper Wires | Aluminum Wire | Ultrasonic Bonding | |
| Semiconductor Coating | Silicone or Epoxy Resin | Potting | |
| External Output Pin | Solder-Plated Steel or Copper | Lead-Free Soldering | |
| Package | Glass and Polyester | Joined Using an Epoxy Sheet | |