SANYO Semiconductor HOME > Product Information > Hybrid IC (STK Series) > Bare Chip Mounting And Aluminum Wire Bonding

Hybird IC (STK Series)

Fusion of Core Technologies
What Is An “gInsulated Metal Substrate“?
Substrate Structure
Assembled Structure
Bare Chip Mounting And Aluminum Wire Bonding
Assembly Flow
Heat Dissipation Capability
High Reliability
High Performance

Bare Chip Mounting And Aluminum Wire Bonding

IMST^TM(Insulated Metal Substrate Technology) is a method of mounting semiconductor devices (such as power transistors, ICs and diodes) using bare chips. Bare chip devices are connected to the copper foil patterns that form the circuits using ultrasonically bonded aluminum wires. SANYO has established this bonding technology, which uses aluminum wires with a diameter ranging from 30µm to 400µm. The size is determined according to the level of the current flowing through the aluminum wires and purpose for which the wires are used (whether as jumper wires or grounding wires, for instance).