SANYO Semiconductor HOME > Product Information > Hybrid IC (STK Series) > Substrate Structure
Hybird IC (STK Series)
- Inverter HICs for Home Appliances
- Audio Power HICs
- Fusion of Core Technologies
- What Is An “gInsulated Metal Substrate“?
- Substrate Structure
- Assembled Structure
- Bare Chip Mounting And Aluminum Wire Bonding
- Assembly Flow
- Heat Dissipation Capability
- High Reliability
- High Performance
Substrate Structure
SANYO's IMSTTM substrates use aluminum (Al), a metal, as their base. In terms of their structure, the two sides of this aluminum base substrate are processed, and epoxy resin (insulator) is used to press-bond the copper foil. In this way, SANYO makes it possible to create hybrid ICs which, on the one hand, have an excellent heat dissipation because of the high thermal conductivity that is a major feature of aluminum and which, on the other hand, are easy to fabricate because of the mechanical strength inherent to aluminum.
Optimal characteristics can be created for a wide range of application products by modifying the structural elements of the IMSTTM substrate, namely the material and thickness of the insulating resin, the thickness of the copper foil used, and the thickness of the aluminum plate itself.
IMSTTM Substrate cross section
IMSTTM Substrate enlarged photo of cross section
Structural elements of IMSTTM substrates
| Structual Elements | Material | Thickness | Application Example |
|---|---|---|---|
| Conductor | Copper Foil | 18µm | Low Capacitance Fine Pattern |
| 35µm | Low current | ||
| 70µm | Medium Vurrent | ||
| 105µm | High current | ||
| Insulating Resin | Filling of Inorganic Filler Epoxy |
50µm | Low Thermal Resistance |
| 80µm | High Withstand Voltage | ||
| Base Plate | Aluminum Plate | 1.5mm | |
| 2.0mm |