SANYO Semiconductor HOME > Product Information > Hybrid IC (STK Series) > Assembly Flow
Hybird IC (STK Series)
- Inverter HICs for Home Appliances
- Audio Power HICs
- Fusion of Core Technologies
- What Is An “gInsulated Metal Substrate“?
- Substrate Structure
- Assembled Structure
- Bare Chip Mounting And Aluminum Wire Bonding
- Assembly Flow
- Heat Dissipation Capability
- High Reliability
- High Performance
Assembly Flow(Transfer Mold)
SANYO's IMSTTM hybrid ICs (STK series) excel not only in terms of their electrical characteristics, but also from the standpoint of their mechanical strength because the base substrates are metal. As a result, even in their production processes, unique systems that are "easy to fabricate" and that only IMSTTM can deliver are developed, and outstanding quality is built into products.
