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Hybird IC (STK Series)

Heat Dissipation Capability

In order to integrate such elements as the power transistors used in the output stage of electronic equipment, ICs with increasing larger scales of integration, and digital signal processing circuits on a single miniature hybrid IC by high-density mounting, it is necessary to ensure that the heat which builds up on the HIC when the components are very densely mounted is dissipated efficiently. The IMSTTM hybrid ICs (STK series) use aluminum plates as the base substrates and, compared with other PCBs and ceramic substrates, they diffuse the built up heat that is to be dissipated very efficiency. It is for this reason that these HICs can handle such high current and power levels. In addition, the IMSTTM substrates themselves act as a kind of heat sink, so small hybrid ICs can even do without heat sinks. IMSTTM is a high-density mounting technology ideally suited to power electronics.

Comparison of copper foil fusing currents

The graph compares the fusing current when high levels of current
have flowed to the copper foil formed on the IMSTTM substrates and on PCBs.
A foil with a thickness of 35 µm and a width of 1.0 mm, can carry up to 52 A
when formed on an IMSTTM substrate, but only 12 A when formed on PCB.

Chip resistor temperature rise comparison

IMSTTM can handle about 4 times the power of PCB.

The graph compares the temperature rise characteristics when chip resistors are mounted on
IMSTTM substrates and when they are mounted on PCBs.
It shows that the temperature rises to 100 C° when 1.2 W of power is applied to the
IMSTTM substrates whereas with PCBs it rises to the same level when only 0.3 W is applied.

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