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Hybird IC (STK Series)

• Fusion of Core Technologies
• What Is An “gInsulated Metal Substrate“?
• Substrate Structure
• Assembled Structure
• Bare Chip Mounting And Aluminum Wire Bonding
• Assembly Flow
• Heat Dissipation Capability
• High Reliability
• High Performance

What Is An “gInsulated Metal Substrate“?

SANYO became the first company in the world (in 1969) to develop IMST^TM, or Insulated Metal Substrate Technology, which forms electronic circuits on plates of aluminum, that is to say, on metal substrates. Hybrid ICs that use this technology use these plates of aluminum with its high thermal conductivity for their base substrates. The company's hybrid ICs, which enable power output circuits, control circuits and their peripheral circuits to be mounted on the same substrate, are widely known as the STK brand, and the company has built up an impressive sales record and a reputation for reliability, particularly in the field of power electronics. We are living in an age of high-density mounting, which is developing at a rapid clip. IMST^TM, which has succeeded in turning bare chip mounting into an element technology since the beginnings of its development, will continue to evolve as an outstanding mounting technology capable of delivery high density, high performance and high reliability.

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