SANYO Semiconductor HOME > Product Information > Hybrid IC (STK Series) > High Reliability

Hybird IC (STK Series)

• Fusion of Core Technologies
• What Is An “gInsulated Metal Substrate“?
• Substrate Structure
• Assembled Structure
• Bare Chip Mounting And Aluminum Wire Bonding
• Assembly Flow
• Heat Dissipation Capability
• High Reliability
• High Performance

High Reliability

What significantly affects the reliability of electronic products is the number of soldered connections. IMST^TM devices use ultrasonic bonded aluminum wires and allows the number of soldered connections to be reduced. IMST^TM, which stands for Insulated Metal Substrate Technology, is a mounting technique that yields a high level of reliability while achieving high-density mounting.

Comparison of the number of connection for an IMST^TM substrate and for PCB mounting

When IMST^TM and PCBs are compared, the number of connections from point A to point B in the figure below is 8 for PCBs, whereas it is only 3 for IMST^TM.

To top of page

Site map