SANYO Semiconductor HOME > Product Information > Hybrid IC (STK Series) > Fusion of Core Technologies
Hybird IC (STK Series)
- Inverter HICs for Home Appliances
- Audio Power HICs
- Fusion of Core Technologies
- What Is An “gInsulated Metal Substrate“?
- Substrate Structure
- Assembled Structure
- Bare Chip Mounting And Aluminum Wire Bonding
- Assembly Flow
- Heat Dissipation Capability
- High Reliability
- High Performance
Fusion of Core Technologies
By combining three of its core technologies-namely, its mounting technologies, package technologies and design technologies-in sophisticated ways, SANYO is supplying the market with hybrid ICs that have been optimized for various applications.
Mounting Technologies
It is now possible to mount power device bare chips using SANYO's unique Insulated Metal Substrate Technology IMSTTM.
- Outstanding heat-radiating capability
- Mountied bare chip
- Aluminum wire bonding
- Integrated mounting of power devices and control ICs
Package Technologies
The introduction of transfer molded packages has made it possible to make products even smaller and easier to use.
- Transfer molded SIPs/DIPs
- Lower profile and thinner form factor
- Higher reliability
- Lead free conversion
Design Technologies
SANYO is developing optimized hybrid ICs (STK series) using such tools as dedicated CAD systems for pattern design, thermal analysis and stress simulation.
- Development of SANYO's ICs and transistors
- SANYO's original CAD system
- Simulation
- Accumulated design know-how