ISB (Integrated System in Board): original SiP(System in Package) technology
System Solution Platform
To increase user convenience, further increases in functionality and performance are desired in electronic equipment. At the same time, rapid progress is being made in portability. Integration on single chips of the semiconductor device peripheral circuits used internally in these products is indispensable for achieving the miniaturization and reduced weight associated with these trends. However, the long development periods and high development cost of SoC (system IC) technology remains an impediment to progress.
SANYO positions its Integrated System in Board technology as a next generation SIP technology that can shorten the development period and hold down development costs. SANYO proposes its Integrated System in Board technology to customers involved in the business of design and development of electronic equipment as a platform for system solutions. We hope you will look into Integrated System in Board as a means for implementing commercial realizations of your inventive and creative ideas that, up to now, were impossible to implement.
Flexible support for the customer's design environment
Logic IC integration level and design productivity
Design productivity is improved by adopting ISB, and development efficiency can be improved as well.
ISB Design Development System
In general, our role as semiconductor manufactures is seen as that of designing the required logic and circuit in response to the required functionality and specifications of the customer (usually, an end-product manufacturer), and of manufacturing that device in a semiconductor process. (Type 1) As a result, the collaboration between the customer and the semiconductor manufacturer from the planning and design stages becomes a crucial aspect of the process.
In addition to this standard type of collaboration, SANYO also provides a system (type 4) that can support an ISB assembly method based on data created by the customer at the point the customer's mask design has been completed in the customer's design environment.
In this method, once the components to be included are ready, the process from frame creation to sample shipment can normally be completed in two to three weeks. This is an optimal method for cases where the customer desires even shorter development period or wants to include their own unique functionality.