Flash Memory/EEPROM

Lineup of many and varied packages including ultra-small WLP packages
Small Package EEPROM (2K to 128K)

As part of ongoing efforts to extend its lineup of small package EEPROM, SANYO Semiconductor Co., Ltd. has developed 2K to 128K memory devices housed in wafer level packages (WLP) and other small packages.

Besides supporting USLPs (see Note 1), the company has also developed a line of WLP devices that are even smaller and thinner in order to support application in portable products and module products.

Note 1: USLP = “Ultra thin Small outline Land Peripheral packages” is our original package name.

Main features

  1. Lineup of many different kinds of small packages
    Ultrasmall packages including WLP available; ideally suited for small modules destined for portable products.
  2. Interface: I²C bus (see Note 2) and SPI bus supported (see Note 3)
    Two types of EEPROM (a regular I²C bus-compatible device and an SPI bus-compatible device) are available.
  3. High-speed operation enabled across a wide supply voltage range
    In the regular I2C bus-compatible device, operation at 400 kHz is possible over the entire supply voltage range from 1.8 V to 5.5 V.
    In the SPI bus-compatible device, operation is possible at 3 MHz from 1.8 V to 5.5 V and at 5 MHz from 2.5 V to 5.5 V.

Note 2: I2C Bus is a trademark of Philips Corporation.

Note 3: Sample shipments of SPI bus-compatible devices are scheduled to begin in the fourth quarter of 2007.

Overview

The quest to create the smallest and slimmest portable products is unrelenting, and compact, thin and high-performance devices are in demand for the component modules and electronic components incorporated into these products.
Nowadays, the finished product manufacturers are pinning their hopes on WLPs, which are capable of minimizing package sizes.

In response to this demand, SANYO Semiconductor has developed a line of EEPROM in various packages.
The memory sizes range from 2K to 128K and they support supply voltages ranging widely from 1.8 V to 5.5 V.
The lineup enables users to choose the packages best suited to their needs across a broad spectrum, from home electrical appliances and portable devices to module products.
It is now possible to mount the EEPROM where they could not be mounted in the past in such applications as module products for portable devices.
In this way, the space savings on circuit boards and flexible circuit boards can be maximized, thereby contributing to reducing the external dimensions of products.

Features

  1. Lineup of many different kinds of small packages
    Ultrasmall packages including WLP available; ideally suited for small modules destined for portable products.
    • USLP8 (Ultra thin Small outline Land Peripheral package)
    • MSOP8 (Micro Small Outline Package)
    • WLP6/8 (Wafer Level Package)
  2. Interface: I²C bus (see Note 2) and SPI bus supported (see Note 3)
    Two types of EEPROM (a regular I²C bus-compatible device and an SPI bus-compatible device) are available.
  3. High-speed operation enabled across a wide supply voltage range
    In the regular I²C bus-compatible device, operation at 400 kHz is possible over the entire supply voltage range from 1.8 V to 5.5 V.
    In the SPI bus-compatible device, operation is possible at 3 MHz from 1.8 V to 5.5 V and at 5 MHz from 2.5 V to 5.5 V.
    It is therefore possible to support a broad spectrum of fields ranging from home electrical appliances and portable products to module products.

Specifications

  1. Supply voltage range: 1.8 V to 5.5 V
    LE2*C**: 2.5 to 5.5 V
    LE2*A**: 2.5 to 5.5 V
    LE2*H**: 2.7 to 5.5 V
    LE2*L**: 1.8 to 3.6 V
  2. Maximum operating clock
    3 MHz (1.8 to 5.5 V), 5 MHz (2.5 to 5.5 V) [SPI bus-compatible device]
    400 kHz (1.8 to 5.5 V) [I²C bus-compatible device]
  3. Operating temperature: -40 to +85 °C
  4. Package: USLP, MSOP, WLP

Product lineup

Package (size in mm units)
USLP8
(1.3x2.0)		 USLP8
(3.0x2.0)		 MSOP8
(150mil)		 WLP6
(1.06x1.50)		 WLP8
(1.06x2.01)
Memory size 2K(I²C) LE24C0221LQ
LE24A0221LQ
LE24H0221LQ
LE24L0221LQ		   LE24C0221TT
LE24A0221TT
LE24H0221TT
LE24L0221TT		    
4K(I²C) LE24C042LQ
LE24A042LQ
LE24H042LQ
LE24L042LQ		   LE24C042TT
LE24A042TT
LE24H042TT
LE24L042TT		    
8K(I²C) LE24C082LQ
LE24A082LQ
LE24H082LQ
LE24L082LQ		   LE24C082TT
LE24A082TT
LE24H082TT
LE24L082TT		    
16K(I²C) LE24C162LS
LE24A162LS
LE24H162LS
LE24L162LS		 LE24C162TT
LE24A162TT
LE24H162TT
LE24L162TT		    
32K(I²C)   LE24C322LS
LE24A322LS
LE24H322LS
LE24L322LS		 LE24C322TT
LE24A322TT
LE24H322TT
LE24L322TT		 LE24LA322CS LE24L322CS
64K(I²C) LE24AB642LS
LE24HB642LS
LE24LB642LS		   LE24LB642CS  
64K(SPI)
(*note4)		   LE25AA642LS
LE25HA642LS
LE25LA642LS		     LE25LA642CS
128K(SPI)
(*note4)		   LE25AB1282LS
LE25HB1282LS
LE25LB1282LS		      

* Note 4: 64K and 128K samples of the SPI bus-compatible devices are currently being developed. They are scheduled to be ready for use as engineering samples in the fourth quarter of 2007.

Flash products are licensed from Silicon Storage Technology, Inc., (USA), and manufactured and sold by SANYO Semiconductor Co., Ltd.

Please note that though all information given, including specifications, was correct as of the press announcement on June 7, 2007, the information may no longer be current.

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