Ver.3
Quality and Reliability HAND BOOK
- Chapter1:
Reliability of Semiconductor Device - 1-1:
Basic Policy Toward Quality and Reliability - 1-2:
Quality and Reliability Assurance System of Sanyo LSI - 1-3:
Quality and Reliability Construction of Sanyo LSI
- 1-1:
- Chapter4:
Failure Mechanisms of Semiconductor Devices - 4-1:
Overview of Failure Mechanisms of Semiconductor Devices - 4-2:
Electromigration - 4-3:
Stressmigration - 4-4:
Stability - 4-5:
Hot Carrier Injection - 4-6:
Time Dependent Dielectric Breakdown (TDDB) - 4-7:
Electrostatic Breakdown - 4-8:
Latch-up - 4-9:
Soft Error - 4-10:
Moisture Resistance - 4-11:
Data Retention Characteristic of Non-Volatile Memory - 4-12:
Thermal Stress of SMD in Solder Mounting - 4-13:
Reliability Degradation Caused by Environmental Thermal Stress - 4-14:
Wire Bonding Degradation - 4-15:
Reliability of MCP Structure - 4-16:
EMC
- 4-1:
- Chapter8:
Appendices